发明名称 |
Semiconductor packages and methods of fabricating the same |
摘要 |
A semiconductor package and module, and methods of fabricating the same are provided. A method of fabricating a semiconductor package may include bonding rear surfaces of first and second semiconductor chips to each other, each of the semiconductor chips having chip pads exposed on front surfaces. The method may also include forming an encapsulation portion configured to encapsulate side surfaces of the bonded semiconductor chips, forming via plugs configured to pass through the encapsulation portion, forming an insulating layer configured to expose surfaces of the chip pads and the via plugs on the exposed surfaces of the two semiconductor chips and surfaces of the encapsulation portion, and forming package pads on the exposed surfaces of the chip pads and the surfaces of the via plugs.
|
申请公布号 |
US7807512(B2) |
申请公布日期 |
2010.10.05 |
申请号 |
US20090320916 |
申请日期 |
2009.02.09 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE TEAK-HOON;KIM PYOUNG-WAN;KIM NAM-SEOG;JANG CHUL-YONG |
分类号 |
H01L21/00;H01L21/30;H01L21/46 |
主分类号 |
H01L21/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|