SUBSTRATE CUTTING APPARTUS AND METHOD FOR CUTTING SUBSTRATE USING THE SAME

摘要

PURPOSE: A board cutting apparatus and method using a laser are provided to cut out a part of a board by emitting laser beam of ultraviolet ray. CONSTITUTION: A board cutting apparatus comprises a stage part(20), a laser generator(30), and a beam swing part(50). The stage part supports a board(10) cut along an imaginary cutting line. The laser generator eliminates a part of the board using laser beam of ultraviolet ray to cut the board. The beam swing part is arranged on the optical path of the laser beam and varies the angle of the laser beam propagating to the cutting line to swing the laser beam to the direction parallel to the cutting line.