发明名称 |
Circuit board with cooling function |
摘要 |
The manufacturing process of a circuit board includes forming a thermal interface layer on a first metal thin layer of a thermal plate. Joining a second metal layer of a main circuit board comprises at least one opening with the thermal interface layer. Then, reflowing the main circuit board with the joined thermal plate. A circuit board with a cooling function using the foregoing manufacturing process is also provided.
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申请公布号 |
US7808786(B2) |
申请公布日期 |
2010.10.05 |
申请号 |
US20090465040 |
申请日期 |
2009.05.13 |
申请人 |
EVERLIGHT ELECTRONICS CO., LTD. |
发明人 |
LIANG CHI-HAO;ZHONG XIE-ZHI;KUO HUI-YING |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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