A THREE-DIMENSIONAL ELECTRONICS PACKAGE

摘要

PURPOSE: A three dimensional electrical appliance package is provided to control the speed and the density of communication between vertically stacked dies and a substrate. CONSTITUTION: A memory die(110) includes a memory circuit component(112). The memory circuit component is in connection with memory die contacts(114). The memory die contacts are located on the external surface(116) of the memory die. A logic die(120) includes a logic circuit component(122). A plurality of combining components combines input-output contacts(132) on the surface of a substrate(105). A dielectric material is arranged between the memory die and the logic die.