发明名称 Inductor for a system-on-a-chip and a method for manufacturing the same
摘要 An inductor for a system-on-a-chip and a method for manufacturing the inductor are disclosed. The inductor comprises a conductive line formed by connecting a plurality of conductive patterns grown from a seed layer formed on a lower wiring. The method comprises using an electrolytic plating process or an electroless plating process to grow the plurality of adjacent conductive patterns from the seed layer until they become connected. The method also enables adjusting the height and width of the conductive line to desired levels.
申请公布号 US7807337(B2) 申请公布日期 2010.10.05
申请号 US20080968787 申请日期 2008.01.03
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE HYO-JONG;SON HONG-SEONG;LEE UI-HYOUNG;HAH SANG-ROK;KIM IN-RYONG;KIM YI-GWON
分类号 G03F7/26;H01L27/04;H01F17/00;H01F41/04;H01L21/02;H01L23/522;H01L27/08 主分类号 G03F7/26
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