发明名称 Using refrigeration and heat pipe for electronics cooling applications
摘要 A cooling system includes a heat pipe and a refrigerator. A combination at least one or more of the heat pipe and the refrigerator is used to cool an electronic component capable of generating heat. Depending on the cooling requirement, a different cooling combination may be used.
申请公布号 US7805955(B2) 申请公布日期 2010.10.05
申请号 US20060618795 申请日期 2006.12.30
申请人 INTEL CORPORATION 发明人 MONGIA RAJIV K.
分类号 F25D23/12 主分类号 F25D23/12
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