发明名称 |
Method of forming metallic oxide films using atomic layer deposition |
摘要 |
Example embodiments are directed to methods of forming a metallic oxide film using Atomic Layer Deposition while controlling the power reflected by a reactor. The method may include feeding metallic source gases, for example, first and second metallic source gases, and/or a reactant gas including oxygen into the reactor individually. One of the metallic source gases may include an amino-group or an alkoxy-group and another metallic source gas may include neither an amino-group nor an alkoxy-group. A plasma may be produced in the reactor from the reactant gas.
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申请公布号 |
US7807584(B2) |
申请公布日期 |
2010.10.05 |
申请号 |
US20070812882 |
申请日期 |
2007.06.22 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM JU-YOUN;WON SEOK-JUN;KIM WEON-HONG;SONG MIN-WOO;PARK JUNG-MIN |
分类号 |
H01L21/461 |
主分类号 |
H01L21/461 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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