发明名称 Method of forming metallic oxide films using atomic layer deposition
摘要 Example embodiments are directed to methods of forming a metallic oxide film using Atomic Layer Deposition while controlling the power reflected by a reactor. The method may include feeding metallic source gases, for example, first and second metallic source gases, and/or a reactant gas including oxygen into the reactor individually. One of the metallic source gases may include an amino-group or an alkoxy-group and another metallic source gas may include neither an amino-group nor an alkoxy-group. A plasma may be produced in the reactor from the reactant gas.
申请公布号 US7807584(B2) 申请公布日期 2010.10.05
申请号 US20070812882 申请日期 2007.06.22
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM JU-YOUN;WON SEOK-JUN;KIM WEON-HONG;SONG MIN-WOO;PARK JUNG-MIN
分类号 H01L21/461 主分类号 H01L21/461
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