METHOD FOR CUTTING SUBSTRATE USING THE SAME

摘要

PURPOSE: A board cutting method is provided to stably cut multiple bonded boards by forming the same groove lines on the boards along an imaginary cutting line. CONSTITUTION: A board cutting method comprises steps of: arranging a compressed panel(10) including two or more bonded boards(11,12) to an imaginary cutting line; forming groove lines(GL) along the cutting line on the boards using laser beam swung by varying the angle to the compressed panel; and cutting the compressed panel along the groove lines.