发明名称 Method of manufacturing semiconductor element
摘要 A method of manufacturing a semiconductor element includes implanting ions of a dopant having a large diffusion coefficient into a semiconductor to provide a doped layer; and irradiating the doped layer with a plurality of pulsed laser beams supplied by a plurality of laser irradiation devices to activate the doped layer and provide an activated doped layer. The activated doped layer may be one of a single doped layer or a plurality of successive doped layers which each have respective conduction types that are one of identical or different. Device breakage and failure of the manufactured semiconductor element due to heat induced during laser irradiation are substantially prevented by this method.
申请公布号 US7807554(B2) 申请公布日期 2010.10.05
申请号 US20080071917 申请日期 2008.02.27
申请人 FUJI ELECTRIC SYSTEMS CO., LTD. 发明人 NAKAZAWA HARUO
分类号 H01L21/00 主分类号 H01L21/00
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