A DOWNSET HEATSLUG WHICH USES MATRIX TYPE FOR CSP SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A down set cooling fin for the CSP semiconductor package of the matrix is provided to prevent the deformation of the cooling fin by forming a down set on a particular portion of the cooling fin sheet using the mold. CONSTITUTION: The epoxy is spread on the top of a PCB substrate. A cooling fin(5a) is located on the PCB substrate covered with epoxy. The cooling fin is formed with a down set on a particular portion of the cooling fin sheet using the mold. A path for the mold flow is formed by the down set.