发明名称 |
CURABLE ELECTROMAGNETIC SHIELDING ADHESIVE FILM, METHOD FOR PRODUCING THE SAME, USE OF THE SAME, METHOD FOR PRODUCING ELECTROMAGNETIC SHIELDING ARTICLE, AND ELECTROMAGNETIC SHIELDING ARTICLE |
摘要 |
<p>Disclosed is a curable electromagnetic shielding adhesive film having a curable conductive polyurethane-polyurea adhesive layer (I) and a curable insulating polyurethane-polyurea resin composition layer (II). The curable conductive polyurethane-polyurea adhesive layer (I) contains a polyurethane-polyurea resin (A) which is obtained by reacting a urethane prepolymer (a4) having an isocyanate groupat an end with a polyamino compound (a5), and an epoxy resin (B) having two or more epoxy groups. The urethane prepolymer (a4) is obtained by reacting a carboxyl group-containing diol compound (a1), a polyol (a2) having a number average molecular weight of 500-8,000 which is not a carboxyl group-containing diol compound, and an organic diisocyanate (a3). The curable conductive polyurethane-polyurea adhesive layer (I) also contains 10-700 parts by weight of a conductive filler per 100 parts by weight of the total of the polyurethane-polyurea resin (A) and the epoxy resin (B). The curable insulating polyurethane-polyurea resin composition layer (II) contains a polyurethane-polyurea resin (C) which is obtained by reacting a urethane prepolymer (c4) having an isocyanate group at an end with apolyamino compound (c5), and an epoxy resin (D) having two or more epoxy groups. The urethane prepolymer (c4) is obtained by reacting a carboxyl group-containing diol compound (c1), a polyol (c2) having a number average molecular weight of 500-8,000 which is not a carboxyl group-containing diol compound, and an organic diisocyanate (c3).</p> |
申请公布号 |
KR20100107043(A) |
申请公布日期 |
2010.10.04 |
申请号 |
KR20107017797 |
申请日期 |
2009.01.15 |
申请人 |
TOYO INK MANUFACTURING CO., LTD. |
发明人 |
MATSUZAWA TAKAHIRO;KOBAYASHI HIDENOBU;KUWABARA AKIFUMI;NISHIYAMA YUJI |
分类号 |
C09J175/02;C09J7/02;C09J9/02;C09J163/00 |
主分类号 |
C09J175/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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