| 摘要 |
PURPOSE: A light emitting diode package is provided to maximize the heat dissipation efficiency by preventing bottle neck phenomenon caused by the resin layer formed on a PCB. CONSTITUTION: A package body(20) comprises an LED(Light Emitting Diode)(11). A bottom heat transfer metal layer(19) is formed on a base side of the package body. An anode electrode(15) and a cathode electrode(16) are formed on the top of the package body. The anode electrode is connected to an anode terminal of the LED chip through a gold wiring(12).
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