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发明名称
METHOD FOR ATTACHMENT OF SOLDER POWDER TO ELECTRONIC CIRCUIT BOARD AND SOLDER-ATTACHED ELECTRONIC CIRCUIT BOARD
摘要
申请公布号
KR100985057(B1)
申请公布日期
2010.10.04
申请号
KR20087002109
申请日期
2006.07.07
申请人
发明人
分类号
H05K3/34
主分类号
H05K3/34
代理机构
代理人
主权项
地址
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