发明名称 |
Sealing apparatus for semiconductor wafer, mold of sealing apparatus, and semiconductor wafer |
摘要 |
A sealing apparatus for sealing by resin a semiconductor wafer having semiconductor elements on its surface. The apparatus includes an upper mold and a lower mold having an area where the semiconductor wafer is mounted, the lower mold having an uneven surface in the area and a shock absorber under the lower mold.
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申请公布号 |
US7800221(B2) |
申请公布日期 |
2010.09.21 |
申请号 |
US20070878927 |
申请日期 |
2007.07.27 |
申请人 |
OKI SEMICONDUCTOR CO., LTD. |
发明人 |
MATSUMOTO JIRO |
分类号 |
B29C45/26;H01L23/34;B29C45/02;B29C45/14;B29C45/37;H01L21/00;H01L21/56;H01L23/12 |
主分类号 |
B29C45/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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