| 摘要 |
A method of manufacturing a contact structure to avoid open issue is provided. The method includes the steps of providing a substrate with a contact region, forming an insulating layer to cover the substrate, forming a contact hole in the insulating layer to expose the contact region, conformally depositing a titanium layer on the insulating layer, conformally depositing a titanium nitride layer on the titanium layer, and performing a plasma process on the titanium nitride layer to remove the impurities in the titanium nitride layer.
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