发明名称 |
System for separation of an electrically conductive connection |
摘要 |
An integrated component includes a semiconductor substrate; at least one interconnect applied on the semiconductor substrate; an insulating layer applied on the at least one interconnect; and at least one opening through the insulating layer which interrupts the at least one interconnect into a first section and a second section.
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申请公布号 |
US7799583(B2) |
申请公布日期 |
2010.09.21 |
申请号 |
US20060544294 |
申请日期 |
2006.10.05 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
RUHL GUENTHER;HAMMER MARKUS;KAINZBAUER REGINA |
分类号 |
H01L21/66 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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