| 发明名称 |
Quad flat pack (QFP) package and flexible power distribution method therefor |
| 摘要 |
A Quad Flat Pack (QFP) package which includes first and second dies arranged in a side-by-side orientation, and a power supply bus which protrudes between adjacent sides of the first and second dies and which supplies power to the adjacent sides via connections to the adjacent sides.
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| 申请公布号 |
US7800205(B2) |
申请公布日期 |
2010.09.21 |
| 申请号 |
US20050216105 |
申请日期 |
2005.09.01 |
| 申请人 |
AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. |
发明人 |
WHELESS, JR. THOMAS O.;BRIGGS RANDALL DON;CUSACK MICHAEL D. |
| 分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
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