| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a card connector equipped with a card heat dissipation mechanism having a high heat dissipation effect regardless of a simple structure without obstructing downsizing of the card connector. <P>SOLUTION: This card connector in order to attach an IC card which is foldable by coupling a first cabinet part and a second cabinet part via a hinge part and in which a heat dissipation pad part is formed in the second cabinet part is equipped with a connector base in which a plurality of contacts connected to a contact pad formed in the first cabinet of the IC card are arranged, and a metal cover which includes a top plate and right and left side walls, and in which by superposition with a connector base, a card housing space is formed where a card insertion port to insert the first cabinet part of the IC card and a part of the first cabinet are housed. The metal cover, in a state that the part of the first cabinet part is housed in the card housing space, is positioned between the first cabinet part and the second cabinet, and is contacted with the heat dissipation pad part formed in the second cabinet part by an elastic contact piece formed at the metal cover. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
