SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a system and method for manufacturing a semiconductor die connection using through-silicon vias (TSVs).

SOLUTION: This semiconductor device is a semiconductor device in which a semiconductor die is manufactured using both via-first TSVs 401 and via-last TSVs 403 for both establishing a low resistance path for a die connection between each of dies 501, 505, 507 adjacent to each other and providing a low resistance path for through channels between a plurality of dies.

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