THIN FILM FORMING APPARATUS AND THIN FILM FORMING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a thin film forming apparatus and a thin film forming method that prevent coating unevenness by preventing an air flow generated from a through-hole from being disordered without staining or damaging a rear surface of an MEMS (Micro Electro Mechanical System) substrate. SOLUTION: The thin film forming apparatus includes a substrate holding member having a holding surface for holding a substrate and a plurality of through-holes formed nearby an end of the holding surface to penetrate the substrate holding member, an elevation member configured to move from the plurality of through-holes to the holding surface to hold a rear-surface end of the substrate conveyed onto the holding surface, a rotary driving unit configured to rotate the substrate held on the holding surface by rotating the substrate holding member when coating a top surface of the substrate with a material for thin film formation, and a through-hole opening/closing unit configured to open one-end portions of the plurality of through-holes in accordance with the operation for conveying the substrate onto the holding surface and to close the one-end portions of the plurality of through-holes in accordance with the rotating operation of the substrate holding member. COPYRIGHT: (C)2010,JPO&INPIT