| 发明名称 |
PHOTOSENSITIVE ADHESIVE COMPOSITION, AND FILM ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER AND SEMICONDUCTOR DEVICE USING THE COMPOSITION |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive adhesive composition having a thermocompression bonding property enabling improvement of connection reliability, and to provide a film adhesive, an adhesive sheet, an adhesive pattern, a semiconductor wafer with an adhesive layer, and a semiconductor device using the composition. <P>SOLUTION: The photosensitive adhesive composition has a minimum melt viscosity of not more than 30,000 Pa s as measured at 20°C to 200°C after pattern formation. <P>COPYRIGHT: (C)2011,JPO&INPIT |
| 申请公布号 |
JP2010223992(A) |
申请公布日期 |
2010.10.07 |
| 申请号 |
JP20090068049 |
申请日期 |
2009.03.19 |
| 申请人 |
HITACHI CHEM CO LTD |
发明人 |
MITSUKURA KAZUYUKI;KAWAMORI TAKASHI;MASUKO TAKASHI;KATOGI SHIGEKI |
| 分类号 |
G03F7/027;C08G73/10;C09J4/00;C09J4/02;C09J7/00;C09J7/02;C09J11/06;C09J163/00;C09J163/10;C09J179/08;C09J201/00;G03F7/004;G03F7/037;H01L21/52 |
主分类号 |
G03F7/027 |
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