| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board which does not cause the erroneous recognition of an electrode pattern formed on the surface of an insulating substrate by an image recognition device, and in which insulation between wires adjacently arranged on the surface of the insulating substrate is maintained. SOLUTION: The multilayer wiring board includes: the insulating substrate 11 which is formed by stacking several insulating layers 11a, 11b, 11c and 11d which comprise: an alumina sintered compact including Si, Mn, Mg and Mo; wiring layers 12 and 13 which are arranged on the surface of and in the insulating substrate 11; and through conductors 14 which are arranged in the insulating substrate 11 and connected to the wiring layers 12 and 13. In this case, Mo is included in the alumina sintered compact as particles whose average diameter is 0.1-0.5μm and whose maximum diameter is 1μm or small. The Mo content is 0.07-0.42 mass%. The brightness of the alumina sintered compact is 40-46%. COPYRIGHT: (C)2011,JPO&INPIT |
