发明名称 PLASMA PROCESSING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To effectively adjust an electric field distribution in the vicinity of a slot antenna to form a uniform electric field distribution in the entire slot antenna by increasing electric field intensity immediately below a stub waveguide, in a slot antenna system microwave plasma processing device including a stub waveguide. <P>SOLUTION: This plasma processing device 100 includes stubs 43A as second waveguides for adjusting an electric field distribution formed on a planar antenna plate 31 constituting a flat waveguide. The stubs 43A are arranged on a conductive cover member 34. The stubs 43A are arranged to vertically superpose on slots 32 constituting a pair of slots arranged in the outermost circumference of the planar antenna plate 31. Annular grooves 28b are formed on the undersurface of a transmission plate 28 to vertically superpose on the stubs 43A. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010232493(A) 申请公布日期 2010.10.14
申请号 JP20090079531 申请日期 2009.03.27
申请人 TOKYO ELECTRON LTD 发明人 OTA RYUSAKU;ADACHI HIKARI;UEDA ATSUSHI
分类号 H01L21/31;H01L21/304;H01L21/3065;H05H1/46 主分类号 H01L21/31
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