| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a phenolaralkyl resin, an epoxy resin composition including the same, and cured material thereof having an excellent heat resistance, which can be used for an electric-electronic component insulating material (a high reliability semiconductor seal material and so on) and a laminate (a print wiring board and so on), or various composite materials such as CFRP, adhesives, paints and so on. <P>SOLUTION: This phenolaralkyl resin is obtained by reacting a 4,4'-bis(halogenomethyl)biphenyl represented by general formula (1) (wherein X is a halogen atom) with a phenol compound using an acid catalyst in the absence of a solvent, and has 50 ppm or less of a residual halogen amount. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
