| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition which has excellent setting characteristics i.e. does not require a high temperature and long treatment, gives excellent curability and storage stability, and is excellent in chemical resistance, heat resistance, and adhesion, and a vanish or a prepreg, laminate and multi-layered printed wiring board using the resin composition. SOLUTION: The thermosetting resin composition (A) resin composition having an unsaturated maleimide group produced by reacting (a) maleimide compound having at least two N-substituted maleimide groups in the molecule with (b) amine compound having at least two primary amine groups in the molecule in an organic solvent, (B) thermosetting resin, and (C) modified imidazole compound such as isocyanate-masked imidazole and epoxy-masked imidazole. COPYRIGHT: (C)2011,JPO&INPIT |
