SEMICONDUCTOR DEVICE ASSEMBLY HAVING A STRESS-RELIEVING BUFFER LAYER

摘要

PURPOSE: A semiconductor device assembly having a stress-relieving buffer layer is provided to prevent the slitting phenomenon of the heat transfer material by removing the increasing factors of concentration force between a buffer layer and a heat discharge apparatus. CONSTITUTION: A semiconductor device(114) is mounted on a chip carrier substrate(112). The semiconductor device is electrically connected with a solder ball(116) to the substrate. An underfill material(118) is formed on the lower part of the semiconductor device. A heat radiator(120) comprises a leg(122) fixed with the adhesive to the substrate.