发明名称 Printed-wiring board with built-in component, manufacturing method of printed-wiring board with built-in component, and electronic device
摘要 According to one embodiment, there is provided a printed-wiring board with a component in which an electronic component is mounted on a pattern-forming surface of a base material. In the printed-wiring board, a guiding path for guiding, to the outside, a void formed in mounting the electronic component is formed on the pattern-forming surface.
申请公布号 US7872874(B2) 申请公布日期 2011.01.18
申请号 US20070701816 申请日期 2007.02.01
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 KARASAWA JUN;SUZUKI DAIGO;TANAKA HIDENORI
分类号 H05K7/10;H05K7/12 主分类号 H05K7/10
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