发明名称 FILM DEPOSITION SYSTEM, EVAPORATION SOURCE DEVICE THEREFOR AND EVAPORATION SOURCE CONTAINER THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a film deposition system where an EL material can be efficiently vaporized and evaporated, and can be fed in high quality and also at a high rate, to provide an evaporation source device therefor, and further, to provide an evaporation source container therefor.SOLUTION: The evaporation source device 20 used in a film deposition system where the surface of the substrate to be vapor-deposited is coated with a vapor deposition material in a vacuum is provided with a heater at the outside thereof, and is further provided with a heater case 210 forming a space at the inside and laminating a plurality of evaporation source containers 220 in a vertical direction so as to be stored. Each evaporation source container 220 is provided with: a container 221 made of a high thermal conduction material which is formed so as to have an almost U-shape in a cross section and formed so as to surround a through-hole 222 for gas discharge almost at the central part; a cover body made of a high thermal conduction material which covers the upper face opening of the container; and a gas gap part introducing the gas of a vapor deposition material generated at the inside of the container into the through-hole for gas discharge from a gap and collecting the gas to a guide part 212 provided at the upper part of the heater case 210 so as to be fed to the surface of the substrate to be vapor-deposited via jet holes 213.
申请公布号 JP2011017065(A) 申请公布日期 2011.01.27
申请号 JP20090163894 申请日期 2009.07.10
申请人 HITACHI HIGH-TECHNOLOGIES CORP 发明人 MATSUURA HIROYASU;DOI HIDEAKI;KATO NOBORU;NIRASAWA NOBUHIRO
分类号 C23C14/24;H01L51/50;H05B33/10 主分类号 C23C14/24
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