| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition of alkaline developing type for forming a coating having high-level flame retardancy, high plasticity, high resolution, high soldering heat resistance, high moisture resistance, high adhesiveness, high chemical resistance, or the like without using a halogen-based flame retardant for improving the flame retardancy, and a flexible printed wiring board using the photosensitive resin composition. <P>SOLUTION: This photosensitive resin composition includes (A) a resin component that contains a (meth)acryloyl group and a carboxyl group in one molecule and is soluble in dilute alkali solution; (B) a base polymer component; (C) a photopolymerizable monomer containing one or more ethylenic unsaturated groups; (D) a photopolymerization initiator; (E) (meth)acrylic group containing phosphorus compound expressed by formula (1) (in formula (1), R is H or CH3); and (F) phosphazene compound. <P>COPYRIGHT: (C)2011,JPO&INPIT |
