| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer electronic component having improved reliability, by preventing a parallel connection through-hole conductor from peeling off from a connecting conductor, during baking. SOLUTION: The multilayer electronic component has a structure in which a first connecting conductor 21 and a second connecting conductor 23 that linearly extend from conductor end portions 21a, 23a of corner portions of an insulator layer 10 to conductor end portions 21b, 23b of a circumferential center line RL side, and a first parallel connection through-hole conductor 65 has a diameter smaller than that of a lead-out conductor through-hole conductor 71. By employing the configuration in which the insulator layer 10 extends linearly in an oblique direction, the conductor end portion 21b of the first connecting conductor 21 and the conductor end portion 23b of the second connecting conductor 23 can sink in an inner layer side by a large amount. Furthermore, since the first parallel connection through hole conductor 65 has a diameter smaller than that of the lead-out conductor through hole 71, the first parallel connection through-hole conductor 65 can bite into the second connecting conductor 23 and the first connecting conductor 21. COPYRIGHT: (C)2011,JPO&INPIT |
