MANUFACTURING METHOD OF PACKAGE, MANUFACTURING METHOD OF PIEZOELECTRIC VIBRATOR, THE PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO-CONTROLLED TIMEPIECE

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a package wherein cracking of a base substrate can be prevented and the yield can be improved. SOLUTION: The manufacturing method of a package equipped with an object which is contained inside a cavity formed between the base substrate and a lid substrate, and a through-electrode arranged in a through-hole penetrating the base substrate and connecting the contained object electrically to the outside includes a recess formation process which forms a recess for the through-electrode in the base substrate 40. The recess formation process includes a step for making a mold member 70, in which a protrusion 71 having a shape identical at least to that of the through-hole is formed, abut against the first surface 40a of the heated base substrate and inserting the protrusion into the base substrate; a step for cooling the base substrate; and a step for separating the mold member from the base substrate. A curved surface 75 is formed in the protrusion of the mold member so that the end of the through-hole on the first surface side has the shape of a curved surface the diameter which increases, as going toward the end. COPYRIGHT: (C)2011,JPO&INPIT