| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition from which a cured film superior in adhesion, electroless gold plating resistance, resolution, thermal shock resistance, electric insulation and solvent resistance is obtained, and to provide a cured product thereof. <P>SOLUTION: The photosensitive resin composition includes: (A) a polymer having a phenolic hydroxyl group; (B) a compound having two or more alkyl etherified amino groups per molecule; (C) a cyclic ether structure-containing compound; (D) a light-sensitive acid generator; and (E) a triazine structure-containing novolac resin. <P>COPYRIGHT: (C)2011,JPO&INPIT |
