| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent an insulation failure due to peeling of a ceramic insulation thin film arranged on the lower surface of a heat sink and exposed from a resin. <P>SOLUTION: In the resin sealing type semiconductor device, an end of a heat sink 3 is a tapered surface 3c, and the tapered surface 3c and a ceramic insulating thin film 6 formed thereon, including the upper end as the end of the upper surface 3a side of the heat sink 3, are covered with the resin 7. In this way, a force F acting to an interface between the ceramic insulating thin film 6 and the resin 7 is dispersed into a force Fa in a normal line direction of the ceramic thin film 6 formed on the surface of the tapered surface 3c and a force Fb in a horizontal direction thereof. Accordingly, durability against peeling can be imparted, and the interface between the resin 7 and the ceramic insulating film 6 can be prevented. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
