发明名称 Electrical device having boardless electrical component mounting arrangement
摘要 An electrical device such as an LED light assembly includes a conductive circuit and one or more electrical components connected to the circuit. The electrical components and the circuit are at least partially overmolded with a thermoplastic polymer material to encapsulate the components. The material utilized to cover the circuit and/or electrical components may also be utilized to form a housing or other structure of a finished part.
申请公布号 US7909482(B2) 申请公布日期 2011.03.22
申请号 US20070842606 申请日期 2007.08.21
申请人 INNOTEC CORPORATION 发明人 VEENSTRA THOMAS J.;VANDER KUYL PAUL T.;WEEDA MATTHEW S.;LANSER MICHAEL L.;ISRAELS KYLE A.;MULDER JASON R.;VANDER POL MARK W.
分类号 F21V21/00 主分类号 F21V21/00
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