发明名称 |
Electrical device having boardless electrical component mounting arrangement |
摘要 |
An electrical device such as an LED light assembly includes a conductive circuit and one or more electrical components connected to the circuit. The electrical components and the circuit are at least partially overmolded with a thermoplastic polymer material to encapsulate the components. The material utilized to cover the circuit and/or electrical components may also be utilized to form a housing or other structure of a finished part.
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申请公布号 |
US7909482(B2) |
申请公布日期 |
2011.03.22 |
申请号 |
US20070842606 |
申请日期 |
2007.08.21 |
申请人 |
INNOTEC CORPORATION |
发明人 |
VEENSTRA THOMAS J.;VANDER KUYL PAUL T.;WEEDA MATTHEW S.;LANSER MICHAEL L.;ISRAELS KYLE A.;MULDER JASON R.;VANDER POL MARK W. |
分类号 |
F21V21/00 |
主分类号 |
F21V21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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