| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component capable of simplifying a process. SOLUTION: A collective substrate 10 wherein a resin layer 14 is formed on one principal surface 12b of a substrate 12 and division grooves 13 are formed from the other principal surface 12a side is prepared. First tools 32, 34 are arranged on the substrate 12 side and on both sides of the division groove 13x of the collective substrate 10, and a second tool 30 is arranged on the resin layer 14 side of the collective substrate 10 to face the division groove 13x, thereafter the first tools 32, 34 and the second tool 30 are relatively moved to press both sides of the division groove 13x of the substrate 12 toward the resin layer 14 by the first tools 32, 34, the resin layer 14 is pressed toward the substrate 12 along the division groove 13x by the second tool 30, thereby the substrate 12 and the resin layer 14 are bent, a crack 16 is advanced from the substrate 12 to the resin layer 14 along the division groove 13x to divide the substrate 12 and the resin layer 14, and thereby individual pieces of electronic components are formed. COPYRIGHT: (C)2011,JPO&INPIT |
