| 摘要 |
PROBLEM TO BE SOLVED: To provide a reliable and compact electronic device, and to provide a method of manufacturing the same. SOLUTION: A piezoelectric oscillator 1 includes a substrate 4 for packaging, a package 3 that is mounted at one main surface side of the substrate 4 for packaging and stores a piezoelectric vibration piece 2, and an electronic component 6 that is mounted between the substrate 4 for packaging and an outer bottom face of the package 3 and drives the piezoelectric vibration piece 2. The substrate 4 for packaging includes a first nearly horizontal region surface 400a on which the electronic component 6 is mounted, and a bending part 401 disposed at both sides of the first region surface 400a and formed by bending the substrate 4 for packaging so that a second region surface 401b facing at a position closer to an outer bottom face of the package 3 than to the first region surface 400a is formed. On a plurality of connection patterns 48 provided on the second region surface 401b, projections 60 projecting toward an outer bottom face of the package 3 are provided, and the substrate 4 for packaging is joined to the package 3 via the projections 60. COPYRIGHT: (C)2011,JPO&INPIT |
