| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroconductive paste thermally curable at≤150°C, capable of forming an electroconductive film exhibiting excellent adhesiveness, for example, to the surface of a PET film or a polyimide film, and having flexibility and toughness, and suitable for the formation of a wiring layer of a flexible printed board. SOLUTION: The electroconductive paste is obtained by selecting an acrylic resin having 284-946 epoxy equivalent, 58-155 hydroxy value, 30,000-170,000 molecular weight, and 10-55°C glass transition temperature as a resin component, and compounding 3-8 pts.mass of the acrylic resin, 0.1-1.5 pts.mass of a silane coupling agent and 8-25 pts.mass of an organic solvent having≥150°C and≤266°C boiling point under the normal pressure with 100 pts.mass of metallic silver powder. COPYRIGHT: (C)2011,JPO&INPIT |
