发明名称 POLYESTER RESIN AND RESIN COMPOSITION FOR MOLDING AND ARTICLE MOLDED BY USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a base stock for sufficiently satisfying various performances such as waterproof property, electric non-conductance, working environmental properties, productivity, durability and fuel resistance as a polyester resin or resin composition for molding which is used for molding electric or electronic components each having a complicated shape. SOLUTION: The polyester resin for molding has &ge;1,500 equivalents/ton aromatic ring concentration. The resin composition for molding and articles molded by using the polyester resin and resin composition for molding are provided. It is preferable that a saturated polyester resin for molding has 5-1,000 dPa-s melt viscosity and satisfies a&times;b&ge;500 (wherein a is the tensile strength at break (N/mm<SP>2</SP>) of a film-shaped molded article; b is the tensile elongation at break (%) thereof). The resin composition for molding and articles molded by using the saturated polyester resin and resin composition for molding are provided. COPYRIGHT: (C)2011,JPO&amp;INPIT
申请公布号 JP2011122164(A) 申请公布日期 2011.06.23
申请号 JP20110006965 申请日期 2011.01.17
申请人 TOYOBO CO LTD 发明人 NISHIDA MITSUO;IRITANI OSAMU
分类号 C08G63/672;B29C45/00;C08L67/02;H01L21/56;H01L23/29;H01L23/31 主分类号 C08G63/672
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