| 摘要 |
To provide an optical device and the like in which attaching is performed more reliably when a bonding wire is attached to a bonding pad. An optical device comprises a substrate having a first surface 11A and a second surface 11B that is opposite the first surface 11A; a light-emitting element 14 having a first center 14-1, the light-emitting element 14 being installed on the second surface 11B; and a light-receiving element having a second center 16-1, the light-receiving element 16 being installed on the first surface 11A. At least a part of the light-emitting element 14 is arranged at a position that overlaps the light-receiving element 16 with respect to a plan view; the light-receiving element 16, which is installed after the light-emitting element 14, has a bonding pad 16A'; the bonding pad 16A' is provided at a position that is displaced relative to the second center 16-1 towards a first direction DR1 with respect to the plan view; and the first center 14-1 is provided at a position that is displaced relative to the second center 16-1 towards a second direction DR2, which is opposite the first direction DR1, with respect to the plan view. |
