| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit member connecting adhesive film actualizing good electric connection between circuit members to be connected to each other during COG (CHIP-ON-GLASS) mounting or COF (CHIP-ON-FLEX) mounting using the circuit members having fine connection terminals, while more reliably improving insulation between the adjacent connection terminals. SOLUTION: The circuit member connecting adhesive film contains conductive particles. The content ratio of the conductive particles in a region from one face of the circuit member connecting film to a distance twice the average particle size of the conductive particles along the thickness direction satisfies conditions represented by expression (I): C≥C<SB>0</SB>×0.8. A minimum value for the melt viscosity at 40-250°C is 1,000 Pa s or smaller. In expression (I), C is the content ratio (mass%) of the conductive particles in the region, and C<SB>0</SB>is the content ratio (mass%) of the conductive particles in a region from one face to the other face of the circuit member connecting adhesive film. COPYRIGHT: (C)2011,JPO&INPIT
|
