| 摘要 |
PROBLEM TO BE SOLVED: To provide a base of a package for an electronic component that improves reliability of mounting bonding between the package for the electronic component and a circuit board by preventing solder cracking, and to provide the package for the electronic component. SOLUTION: In the base 1 of package for the electronic component that holds an electronic component element, a plurality of terminal electrodes to be bonded to an external circuit board 4 using a conductive bonding material are formed on a bottom surface of the base 1, and the terminal electrodes have functional terminal electrodes 12 and 13 which are electrically connected to the electronic component element and at least a pair of non-connection terminal electrodes 14 and 15 which are not electrically connected to the electronic component terminal. The functional terminal electrodes 12 and 13 are formed at positions close to the center point O of the bottom surface of the base 1 and apart from an outer peripheral end of the bottom surface of the base 1, and the non-connection terminal electrodes 14 and 15 are formed at positions close to the outer peripheral end of the bottom surface of the base 1 while being in contact with a part of the outer peripheral end of the bottom surface of the base 1. COPYRIGHT: (C)2011,JPO&INPIT
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