发明名称 ELECTROSPRAY DEPOSITION DEVICE AND PARTIAL FILM FORMING METHOD
摘要 PROBLEM TO BE SOLVED: To carry out a partial deposition of a desired material at a desired position on a substrate at a high precision so as to repair patterning in an organic EL element or the like. SOLUTION: The electrospray deposition device (ESD) includes a nozzle 11 accommodating a solution of a desired material, a spraying power source 32 for applying a voltage on the nozzle, a converging guard ring 15 for converging a spray range of droplets sprayed from the nozzle, a guard ring power source 36 for applying a voltage or a current on the converging guard ring 15, a partial electrode 21 located at a substrate rear surface side at a depositing position on a substrate 20, and a partial electrode power source 41 for applying to the partial electrode 21 a voltage of a reverse polarity of the voltage applied on the nozzle. As the converging guard ring 15, an electrostatic lens 50 or an assembly of the electrostatic lens 50 and an electromagnetic lens 51 are used. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011175921(A) 申请公布日期 2011.09.08
申请号 JP20100040269 申请日期 2010.02.25
申请人 HITACHI HIGH-TECHNOLOGIES CORP 发明人 ISHIZUKA TOSHIOMI;WATANABE SUSUMU;KATAOKA FUMIO;TANAKA JUN
分类号 H05B33/10;H01L51/50 主分类号 H05B33/10
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