发明名称 Low-Inductance Power Semiconductor Assembly
摘要 A power semiconductor assembly includes at least two bridge branches each including at least two circuit breakers connected to a phase output. Each of the circuit breakers has at least two parallel-connected switching elements integrated into a semiconductor chip. Each of the circuit breakers is arranged in a power semiconductor module and the individual power semiconductor modules are arranged adjacent to one another in a first direction. The semiconductor chips of a particular circuit breaker are arranged adjacent to one another in the corresponding power semiconductor module in a second direction extending perpendicular to the first direction.
申请公布号 US2011216561(A1) 申请公布日期 2011.09.08
申请号 US201113040348 申请日期 2011.03.04
申请人 INFINEON TECHNOLOGIES AG 发明人 BAYERER REINHOLD;DOMES DANIEL
分类号 H02M7/493 主分类号 H02M7/493
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