| 摘要 |
<p>A frame-shaped insulating portion (49) is projected in an upper surface of a cover (44) so as to surround a region where a bonding pad (48) is to be formed. Then a metallic film (68) is formed in the whole upper surface of the cover (44) such that the insulating portion 49 is coated therewith. Then the metallic film 68 with which the insulating portion (49) is coated is ground with a dicer to expose the whole periphery of the insulating portion (49) from the metallic film (68), thereby forming the independent bonding pad (48) in the region surrounded by the insulating portion (49). The metallic film (68) located outside the insulating portion (49) constitutes an electromagnetically=shielding conductive layer (47).</p> |
