| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin composition whose cured product has excellent resistance to thermal decomposition, develops low thermal expansion, and attains good solvent solubility, and to provide the cured product, as well as to provide a printed wiring board superior in heat resistance and low thermal expansion, a novolac epoxy resin giving the performance, and a method for producing the epoxy resin. SOLUTION: This novolac epoxy resin includes a molecular structure of a glycidyl etherified novolac resin obtained by polycondensation of 2,7-dihydroxynaphthalene with formaldehyde. The novolac epoxy resin includes, as essential components, a novolac epoxy resin (A) in which the content of a dimer component of the novolac epoxy resin on a peak area basis when measured with GPC is 26-50%, and a curing agent (B). COPYRIGHT: (C)2011,JPO&INPIT |
