发明名称 RADIATION-CURABLE SELF-ADHESIVE COMPOSITION, SELF-ADHESIVE FILM FOR DICING USING THE SAME, AND METHOD FOR PRODUCING CUT PIECE
摘要 PROBLEM TO BE SOLVED: To provide a self-adhesive having high self-adhesive force in a dicing process so that detachment and scattering of cut pieces of semiconductor elements etc., are suppressed, affording even articles to be processed having an activated surface, excellent light peelability and low staining properties in a pickup process; and to provide a self-adhesive film for dicing having a self-adhesive layer including the self-adhesive. SOLUTION: This radiation-curable self-adhesive composition includes a (meth)acrylic polymer and a multifunctional monomer, where the (meth)acrylic polymer is obtained by reacting a base polymer, having at least a 2-8C linear- or branched-alkyl group-containing (meth)acrylic monomer, a hydroxy group-containing (meth)acrylic monomer and a 14-18C linear-alkyl group-containing (meth)acrylic monomer as copolymerizable monomer components, with a radiation-reactive compound having a radiation-reactive carbon-carbon double bond in the molecule. The self-adhesive film for dicing has a self-adhesive layer including the self-adhesive. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011184576(A) 申请公布日期 2011.09.22
申请号 JP20100051613 申请日期 2010.03.09
申请人 HITACHI MAXELL LTD 发明人 SATO KEIGO;OKUMURA YASUAKI;NAGATAKI YOSHIYUKI
分类号 C09J133/14;C09J4/00;C09J7/02;C09J11/00;H01L21/301 主分类号 C09J133/14
代理机构 代理人
主权项
地址