发明名称 SUBSTRATE DIVIDING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a substrate dividing method in which an aggregate substrate having bumps formed thereon is easily divided into individual substrates. SOLUTION: The aggregate substrate 10a is prepared which includes parts to become a plurality of individual substrates, has components mounted on one principal surface 12s of a substrate body 12, is provided with a protective member 15 covering the components, and also has the bumps formed on the other principal surface of the substrate body 12. In a state where the aggregate substrate 10a is fixed, the aggregate substrate 10a is cut from the side of the protective member 15 to form processed parts 13s and 13t reaching the other principal surface of the substrate body 12. After the aggregate substrate 10a is released from being fixed, a dicing tape is stuck on the protective member 15 to fix the aggregate substrate 10a, which then is cut from the other principal surface side of the substrate body 12 based upon positions of the processed parts 13s and 13t reaching the other principal surface of the substrate body 12 to be divided into the individual substrates. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011187747(A) 申请公布日期 2011.09.22
申请号 JP20100052368 申请日期 2010.03.09
申请人 MURATA MFG CO LTD 发明人 TAKAMORI TAKAMICHI
分类号 H01L21/301 主分类号 H01L21/301
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