SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING METHOD, PROGRAM AND COMPUTER STORAGE MEDIUM

摘要

PROBLEM TO BE SOLVED: To provide a substrate processing device which smoothly and suitably processes a substrate.SOLUTION: A processing container 10 of a bonding device 1 is configured in such a way that an upper container 11 positioned on an upper side and a lower container 12 positioned on a lower side are connected to each other by a shield bellow 13. A processing space K for bonding processing on a wafer W is formed between the upper container 11 and lower container 12. A heat treatment plate 20 is provided in the lower container 12, and a cut groove 21 capable of accommodating a delivery member 42 is formed in an outer peripheral part of the heat treatment plate 20. The upper container 11 is provided with: a support member 41 which extends perpendicularly downward from an under surface of the upper container 11; a delivery member 42 which holds the outer peripheral part of the wafer W and delivers the wafer W to and receives it from the heat treatment plate 20; and a connection part for connecting the support member 41 and delivery member 42 to each other. The delivery arm 40 freely moves in a perpendicular direction together with the upper container 11.