| 摘要 |
PROBLEM TO BE SOLVED: To provide a cyanate resin composition for laminated boards excellent in heat resistance and low thermal expansion, and a prepreg, a metal-clad laminate, a printed wiring board, and a semiconductor device produced using the cyanate resin composition for laminated boards.SOLUTION: The cyanate resin composition for laminated boards contains at least a cyanate resin, an inorganic filler, and a solvent. The cyanate resin composition for laminated boards has gelling time of 90% or more after stored for 7 days at 18-28°C and humidity of 50-70%, assuming that the gelling time at 180°C immediately after preparation is 100%. |
