发明名称 METAL PATTERN FORMING METHOD, AND METAL PATTERN FORMED USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a metal pattern forming method that forms a metal pattern by electroless plating technique, the method forming a pattern excellent in adhesion to a substrate and excellent in a fine line drawing property, and to provided the metal pattern formed by using the method.SOLUTION: In the method of printing a pattern part on a substrate by an inkjet system using an ink containing a catalyst and drying it, and forming the metal pattern by electroless plating processing on the pattern part, the catalyst is a soluble palladium metal complex, the ink containing the catalyst has a pH of 10.0-14.0, and the printed pattern part before the electroless plating processing has a surface roughness Ra of 30 to 45 nm.
申请公布号 JP2011198890(A) 申请公布日期 2011.10.06
申请号 JP20100062098 申请日期 2010.03.18
申请人 KONICA MINOLTA IJ TECHNOLOGIES INC 发明人 SUZUKI SHINICHI;MORI TOMOJI;NAKAJIMA ATSUSHI
分类号 H05K3/18;B05D1/26;H05K3/38 主分类号 H05K3/18
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